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March 2002

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Subject:
From:
"Tempea, Ioan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 Mar 2002 09:45:27 -0500
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text/plain (61 lines)
Hi Jim,

the actual test method is in IPC-TM-650 (2.4.22). This one is not very
specific in defining what actually should be measured (panel or single
board). Still, para 3 says "The test specimens shall be in the form of
either printed boards or multiple printed panels". Then the drawing and the
procedure show a rectangular element that is measured, in my opinion this
shall be the panel.

If the above mentioned rectangular element is not to be the panel, ask the
board fab to singulate each individual board, measure it for warp, just to
make sure it checks out OK and then re-assemble them in panels. But, like
somebody was saying yesterday, talking about PGAs, this could be ignored.

Regards,
Ioan

> -----Original Message-----
> From: [log in to unmask] [SMTP:[log in to unmask]]
> Sent: Thursday, March 14, 2002 8:21 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Board Bow and Twist two answers
>
> Hi Jim
> This is not a question where "the most votes" determines the answer.
> The last sentence in para 3.4.4 states  Panels which contain multiple
> printed
> boards which are assembled on the panel and later separated SHALL be
> assessed
> in panel form.
>
> Susan Mansilla
>
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