Earl,
Take/shear/rip/pop/jimmy/remove some of the solder balls that are still attached and compare.
Note the amount of stress/force it required to remove them!
David A. Douthit
Manager
LoCan LLC
Earl Moon wrote:
> Jim,
>
> BGA's used to be my best friend, except for Arleen Weinberger and other
> ladies of extreme beauty and brains. Now they are a bain, if tha's a proper
> term. It's like the whole BGA world has gone to hell. Even board suppliers
> are starting to suck who once had my total faith and confidence based on
> constant evaluation, re-evaluation, and qualification.
>
> At least now I have a compadre in this mess. Thanks for sharing the gief but
> I'm honestly stumped but for an undying dedication to gettin this damn thing
> resolved. The TI thing was bad enough but now another major supplier adds to
> the MESS.
>
> Did you give us your paper and/or its location? I'm reading all I can, OVER
> AND OVER AGAIN, notwithstanding posting my brains and guts out on this site.
> Hell, even Sir Werner and his cohorts can't do much. It has to be up to the
> suppliers to come forth. Thought I was working concurrently with TI. Now I'm
> not sure again, and haven't even begun talking with the other major supplier
> with whom my last pics are associated.
>
> Your statement about "Every time there was a component failure, it was
> attributed to an open BGA solder joint" sure used to ring true but was
> resolved, for a time. It seems now to be coming back.
>
> Sorry about your, hopefully healed black eye, but should not have been the
> case. However, some should suffer such a fate based on your thoughts about
> how the missing ball attachment area looked compared to mine. This solder
> "remnant" crap is exactly my problem and others soon to experience it. All
> other surface conditions point to some process management inadequacies and
> someone knows what they are and what are the failure modes/mechanisms. Just
> looks like unsolderable surfaces to me and whatever happened to the IMC
> layer whether too thick, too thin, or just plane way to oxidized.
>
> My progress is limited to a very small company resource capability. The
> company has spent way too much time and money doing minimal analysis. Who
> the hell could afford to do more anyway. Like Sir Werner says, this crap is
> just being thrown over the fence for all us ROOKIES to suck through a garden
> hose. I don't do that.
>
> I believe you're right about the nickel gold thing. What else could it be.
> TI even admitted one of its suppliers was replaced to do a better job. That
> hasn't been proven yet either. Maybe Friday it will when we get our first
> assemblies. We'll ge to the bottom, and I do mean bottom, of this soon but
> maybe not soon enough for some.
>
> Thanks JM for some outstanding insights. Finally feels a bit, though sadly,
> comforting having someone else having gone through this.
>
> Earl
>
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