Sounds like a crazy idea to me, 20 inch-pounds sounds like a heck of a lot.
I wonder what the bond strength between the copper and the laminate would
be. The land pattern make a fairly small surface area. Even if you don't rip
the component of the lands you might rip the lands off the board.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Carl Ray
> Sent: Wednesday, March 13, 2002 11:17 AM
> To: [log in to unmask]
> Subject: [TN] Solder Joint Mechanical Stress
>
>
> I have a customer who is requiring that I verify the bond strength of a
> heat sink that is glued to the top of PBGA. The customer has supplied me
> with a torque tool to verify the strength of the bond between the heat
> sink and the BGA. I have concerns that testing the strength of the glue
> bond may affect the solder joint reliability of the BGA. The tool
> supplied by the customer is set at 20 in pound torque. Any ideas how I
> can "change" my customer mind?
>
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