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March 2002

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Subject:
From:
Charles McMahon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Mar 2002 12:14:15 -0500
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text/plain
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Carl:

If the customer is not adamant at testing a finished assembly, can you
suggest using a sample board as
a test platform and assembling the HEAT SINK on it for the boind
strength test?
My bet is you may have already reviewed this option but thoght it worth
mentioning.


Carl Ray wrote:

>I have a customer who is requiring that I verify the bond strength of a
>heat sink that is glued to the top of PBGA. The customer has supplied me
>with a torque tool to verify the strength of the bond between the heat
>sink and the BGA. I have concerns that testing the strength of the glue
>bond may affect the solder joint reliability of the BGA. The tool
>supplied by the customer is set at 20 in pound torque. Any ideas how I
>can "change" my customer mind?
>
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