LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

March 2002

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET March 2002

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Re: Solder Joint Mechanical Stress
From:	[log in to unmask]
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 13 Mar 2002 11:51:43 EST
Content-Type:	text/plain
Parts/Attachments:	text/plain (20 lines)

I would try to establish a set of process parameters to show the customer
repeatable performance using scrap or dummy parts, then show proof of holding
those same process parameters on actual production parts.  That way you
demonstrate statistical conformance to their requirement without risking
damage to production parts, which should be easy to present as a win-win
situation to an intelligent customer.

Jon Moore

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG