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March 2002

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Subject:
From:
Carl Ray <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Mar 2002 10:17:01 -0600
Content-Type:
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I have a customer who is requiring that I verify the bond strength of a
heat sink that is glued to the top of PBGA. The customer has supplied me
with a torque tool to verify the strength of the bond between the heat
sink and the BGA. I have concerns that testing the strength of the glue
bond may affect the solder joint reliability of the BGA. The tool
supplied by the customer is set at 20 in pound torque. Any ideas how I
can "change" my customer mind?

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