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March 2002

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Mar 2002 07:31:01 -0600
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Jim,

BGA's used to be my best friend, except for Arleen Weinberger and other
ladies of extreme beauty and brains. Now they are a bain, if tha's a proper
term. It's like the whole BGA world has gone to hell. Even board suppliers
are starting to suck who once had my total faith and confidence based on
constant evaluation, re-evaluation, and qualification.

At least now I have a compadre in this mess. Thanks for sharing the gief but
I'm honestly stumped but for an undying dedication to gettin this damn thing
resolved. The TI thing was bad enough but now another major supplier adds to
the MESS.

Did you give us your paper and/or its location? I'm reading all I can, OVER
AND OVER AGAIN, notwithstanding posting my brains and guts out on this site.
Hell, even Sir Werner and his cohorts can't do much. It has to be up to the
suppliers to come forth. Thought I was working concurrently with TI. Now I'm
not sure again, and haven't even begun talking with the other major supplier
with whom my last pics are associated.



Your statement about "Every time there was a component failure, it was
attributed to an open BGA solder joint" sure used to ring true but was
resolved, for a time. It seems now to be coming back.

Sorry about your, hopefully healed black eye, but should not have been the
case. However, some should suffer such a fate based on your thoughts about
how the missing ball attachment area looked compared to mine. This solder
"remnant" crap is exactly my problem and others soon to experience it. All
other surface conditions point to some process management inadequacies and
someone knows what they are and what are the failure modes/mechanisms. Just
looks like unsolderable surfaces to me and whatever happened to the IMC
layer whether too thick, too thin, or just plane way to oxidized.

My progress is limited to a very small company resource capability. The
company has spent way too much time and money doing minimal analysis. Who
the hell could afford to do more anyway. Like Sir Werner says, this crap is
just being thrown over the fence for all us ROOKIES to suck through a garden
hose. I don't do that.

I believe you're right about the nickel gold thing. What else could it be.
TI even admitted one of its suppliers was replaced to do a better job. That
hasn't been proven yet either. Maybe Friday it will when we get our first
assemblies. We'll ge to the bottom, and I do mean bottom, of this soon but
maybe not soon enough for some.

Thanks JM for some outstanding insights. Finally feels a bit, though sadly,
comforting having someone else having gone through this.

Earl

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