Peter,

You've hit the nail on the head again. How many more hits
can my MoonCoffinManNail stand?

This part looks exactly like the TI parts I placed earlier and hope the
problem has gone away. Will know that Friday. This is another supplier
altogether and the missing ball site exhibits some "silvery" areas or points
where the ball was attached. The resto of the pad seems un/non/dewettable.
Makes me wonder if this supplier and TI are using the same BGA substrate and
ball attach supplier.

B2B, also please take notice. All the other photos, Steve can get rid of
anytime now, exhibit the same condition as I described but the TI parts
simply fell off the balls that had wetted to the assembly PCB.

I'm not bothering anyone else again on this forum about this crazy
situation. As our dear departed Waylon sang: I've always been crazy but it's
kept me from goin' insane. I've always lived by that and always will.

MoonCrazyMan

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------