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March 2002

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Wed, 13 Mar 2002 11:48:09 +0800
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Hi, Jean-Francois,

I think you meant "Land Pattern" for your question. If so, and you can't
get recommendations from either the manufacturer or from IPC-SM-782, you
are faced with calculating it for yourself. IPC-SM-782 contains a formula
for working it out, or you can download various calculators from the web,
including IPC's at http://search.ipc.org/sm782/default.asp.

Minimum annular ring depends partly on requirements. MIL spec requires 4
mils wile IPC requires 3 mils for class 3 boards. Its purpose, of course,
is to provide some anchorage for plating into holes, so you will have to
decide how much strength and support you need from a pad versus spec
requirements versus space available. Annular ring is related to drilling of
the holes, not so much for soldering components on to. Sorry, I'm no expert
in through-hole component pad design, but since your lead diameter is 0.8
mm (32 mils), I estimate you would be looking for a pad diameter of around
50 mils (1.25 mm).

It's not usual, in my limited experience in these things, to ask what is
the minimum annular ring for a particular size of hole. What I calculate is
the pad size required for a given finished (plated, if plated) hole
diameter. To the hole diameter, add twice the hole plating thickness, then
add the manufacturing tolerences that your fab house works to, then add
twice the annular ring requirement as determined from MIL/IPC specs,
customer requirements, design requirements or whatever applies.
Manufacturing tolerences include things like photo tooling tolerence,
tooling registration tolerence, lamination registration tolerence, material
shrinkage tolerence, drill bit diameter tolerence, drill positional
tolerence, etch tolerence and so on, and are usually consolidated into a
single root mean square value. Our fab houses like to have pad diameter =
finished hole diameter + 22 mils to guarantee our 4 mils annular ring
requirement, if that's any help.

Best of luck

Peter



                                                                                              
                    "Bissonnette,                                                             
                    Jean-Francois"         To:     [log in to unmask]                            
                    <JBissonnette@W        cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST       
                    ABTEC.COM>             Aero/ST Group)                                     
                    Sent by:               Subject:     Re: [TN] DO-41 footprint size         
                    TechNet                                                                   
                    <[log in to unmask]                                                           
                    G>                                                                        
                                                                                              
                                                                                              
                    03/12/02 09:58                                                            
                    PM                                                                        
                    Please respond                                                            
                    to "TechNet                                                               
                    E-Mail Forum.";                                                           
                    Please respond                                                            
                    to                                                                        
                    "Bissonnette,                                                             
                    Jean-Francois"                                                            
                                                                                              
                                                                                              




Maybe I used the wrong terminology here.  Thanks for the dimensions but
that
I
had them already.  What I need (and perhaps someone from the design council
could help here) is the pads dimension required to get proper solder joint.
What
we have from our designer at the moment is quite small and honestly it
looks
like a via more than a pad.  According to IPC-2221 the minimum annular ring
requirement is only 0.002" which I find pretty small if you want to get a
good
solder fillet.  What is the standard annular ring for a 0.050" drilled
hole?

-----Original Message-----
From: Tom Parkinson - Quality System Manager
[mailto:[log in to unmask]]
Sent: Monday, March 11, 2002 4:33 PM
To: [log in to unmask]
Subject: Re: [TN] DO-41 footprint size


DO-41 is THT. See the following:

http://www.ic.nec.co.jp/discrete/english/pkg/do41.html




"Bissonnette, Jean-Francois" wrote:
>
> Hi all,
>
> I need to find information on components footprints.  Is there a place on
> the net
> where I could find information on DO-41 footprint? (and other parts) I
tried
> to
> find it on the Motorola website but came up with nothing.  If possible
I'd
> like
> to know what is Motorola suggestion for the pad size of these diodes.
>
> Jean-François Bissonnette
> Vérificateur, Contrôle de la Qualité
> Électronique
> Produits et Procédés
> Vapor Rail Inc.
> 10655 Henri-Bourassa O.
> St-Laurent, Qc
> H4S 1A1
>
> (514) 335-4200 x2021
> (514) 335-4231 fax
>
>  <<Bissonnette, Jean-Francois.vcf>>
>
> WABTEC CORPORATION CONFIDENTIALITY NOTE
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