Maybe I used the wrong terminology here.  Thanks for the dimensions but that
I 
had them already.  What I need (and perhaps someone from the design council
could help here) is the pads dimension required to get proper solder joint.
What 
we have from our designer at the moment is quite small and honestly it looks
like a via more than a pad.  According to IPC-2221 the minimum annular ring
requirement is only 0.002" which I find pretty small if you want to get a
good
solder fillet.  What is the standard annular ring for a 0.050" drilled hole?

-----Original Message-----
From: Tom Parkinson - Quality System Manager
[mailto:[log in to unmask]]
Sent: Monday, March 11, 2002 4:33 PM
To: [log in to unmask]
Subject: Re: [TN] DO-41 footprint size


DO-41 is THT. See the following:

http://www.ic.nec.co.jp/discrete/english/pkg/do41.html




"Bissonnette, Jean-Francois" wrote:
>
> Hi all,
>
> I need to find information on components footprints.  Is there a place on
> the net
> where I could find information on DO-41 footprint? (and other parts) I
tried
> to
> find it on the Motorola website but came up with nothing.  If possible I'd
> like
> to know what is Motorola suggestion for the pad size of these diodes.
>
> Jean-François Bissonnette
> Vérificateur, Contrôle de la Qualité
> Électronique
> Produits et Procédés
> Vapor Rail Inc.
> 10655 Henri-Bourassa O.
> St-Laurent, Qc
> H4S 1A1
>
> (514) 335-4200 x2021
> (514) 335-4231 fax
>
>  <<Bissonnette, Jean-Francois.vcf>>
>
> WABTEC CORPORATION CONFIDENTIALITY NOTE
> The content contained in this e-mail transmission is legally privileged
and confidential information intended only for the use of the individual or
entity named herein. If the reader of this transmission is not the intended
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>
>
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