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March 2002

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Subject:
From:
"Zweigart, Siegmund" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 12 Mar 2002 13:51:17 +0100
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Hello all

We are currently in the discussion of using a peelable soldermask (Bluemask)
in combination with an OCC /OSP finished blank.
Are there any incompabilities known?
Did anybody make an analises of residues (ionic contaminations) on the blank
after removing the soldermask?
Do you prefer to harden the soldermask by UV or by Heat?

Thank you for your help

Siggi

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