Doug,

I really have a pretty good handle on wave soldering, and most other types,
as well as the ENIG process and its effects as quality, or not. What I'm
asking here is if anyone knows what, in the fab process, might contribute to
non wetting as previously described.

I'm looking for some process step, after solder mask strip leaving bare
copper over which ENIG was applied and after. The after must hold some kind
of answer as the gold looks as it should though no cleanliness/contamination
tests have been conducted, nor will they likely be as time is too short. I
said that?

I'll try to get the pics up today and, with good luck, I should have the
reflow side images as well. I hope this answers Daan's questions as well
because I couldn't really describe the events and effects without the
photos. Steve has spoiled us all with his site and great service.

Earl Moon

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