Folks,

Don't know yet for sure but I may have gotten my client and self in a bit of
a problem. Used this very highly qualified fab supplier for some time. Used
ENIG from them and other quppliers equally qualified and never had this
issue arise and I'm not sure of the cause. I know even the best loose the
recipe but rarely.

Can't post the pictures now as I'm on a different computer without them. The
non wetted pads are on the wave solder side (my assembly house didn't reflow
the important top side using paste per my instructions. Some pads are
partially wetted to about 50%. Many through hole pads wetted and many didn't.

The board was requested to be a solder mask over bare copper, ENIG. Type. As
the ENIG was the last wet chemical process, I'm trying to understand what is
the problem. I mean, there is no resist left as the gold looks as it should
and SM stripping was done over bare copper. What contamination could cause
such problems?

Thanks,

Earl Moon

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