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March 2002

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Subject:
From:
Don Vischulis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 8 Mar 2002 08:00:05 -0600
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Earl

Have you considered a solder fountain for those caps?  Less controlled than
the wave, but probably better than an iron or a selective pallet for a 3X3
area.

Don Vischulis

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Earl Moon
Sent: Friday, March 08, 2002 5:35 AM
To: [log in to unmask]
Subject: Re: [TN] Fab Process question related to ENIG


Yeh, they and many other things get shorted out often. Our design engineers,
in their infinite wisdom did many things wrong. There's one 3 inch square
analog area they placed at the corner of an 11x11" board with you know what
- about a dozen of those blue beuaties, electrolytic caps that is so wave
solder a necessity. Some other through hole stuff as well that needn't be.
Could have been SMT or left on the R/F daughter card. It's all a big
compromise.

Just thinking out loud really about the bottom side solder shields. Anyone
else so I don't have to go to blind vias or wave pallets?

MoonBaseMan

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