At what stage the electroless nickel and immersion gold process is
applied, is it after the solder mask application or before? I believe
normally it is after the solder mask application but I want to verify
it. I have heard that chemistry involved is very nasty if left on the
board. If I plug or mask via holes from one side, I want to make sure
that there is no residue left of that nasty chemistry. Can it be cleaned
if mask from one end? Any comments?
re,
Ken Patel
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------