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Subject:	Re: Bottom Side Reflow!!
From:	"Marsico, James" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 7 Mar 2002 07:03:14 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (46 lines)

Typically, the surface tension of the molten solder for components on the
bottom is enough to hole the parts in place.  It does depend on the size of
the component and amount of solder.  We reflow boards with chip components
on the bottom without any problems.  I guess you'll have to try and see.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   ART HAMPTON [SMTP:[log in to unmask]]
        Sent:   Wednesday, March 06, 2002 4:01 PM
        To:     [log in to unmask]
        Subject:        [TN] Bottom Side Reflow!!

                Hello Out There,

         Recently I was assigned the task of creating profiles that would
fall within the ( PWI ) for solder paste Kester ( 562 ) for processing pcbs
with several (bga) components on the top side, however the bottom side of
the pcb also has 1,200 placements of cap, and res. reflowed not epoxyed, do
I need to be worried about losing my bottom side components?

        Art

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