Hello in there,

No, you do not need to worry about losing bits off the bottom during second
reflow. The surface tension of  liquid solder is more than enough to keep
little passives in place. All my boards have many, many passives underneath
and a few IC's besides, and they all hang on there perfectly.

Peter
STAero



                    ART HAMPTON
                    <smt@Q-TRONIC        To:     [log in to unmask]
                    S.NET>               cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    Sent by:             Aero/ST Group)
                    TechNet              Subject:     [TN] Bottom Side Reflow!!
                    <[log in to unmask]
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                    03/07/02
                    05:00 AM
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                    ART HAMPTON






         Hello Out There,

  Recently I was assigned the task of creating profiles that would fall
 within the ( PWI ) for solder paste Kester ( 562 ) for processing pcbs
 with several (bga) components on the top side, however the bottom side
 of the pcb also has 1,200 placements of cap, and res. reflowed not
 epoxyed, do I need to be worried about losing my bottom side components?

 Art










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