One of the most common causes is using solder paste that has been either
badly stored or past the "use-by" date, especially if it is of low flux
activity which cannot cope with the coat of metal oxides/carbonates that
gradually form on each solder particle.

Brian

"Bissonnette, Jean-Francois" wrote:
>
> Hi all,
>
> we have tiny solder balls on assembly manufactured for us.  Most of the
> little balls
> are around SMT leads and are some times numerous.  What can cause such
> condition?
>
> Jean-François Bissonnette
> Vérificateur, Contrôle de la Qualité
> Électronique
> Produits et Procédés
> Vapor Rail Inc.
> 10655 Henri-Bourassa O.
> St-Laurent, Qc
> H4S 1A1
>
> (514) 335-4200 x2021
> (514) 335-4231 fax
>
>  <<Bissonnette, Jean-Francois.vcf>>
>
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