Hi TechNetters,



we are working on defining our "No Clean" soldering process. The

solder-paste and flux manufacturers certify the "No Clean" capability of



their products to some extend, but what is the definition of "No Clean"?



And I don't mean the statement, that only inert residues of flux and

solder-paste additives remain on the board.

Are there any standards that can used as a reference?

How do you measure the:

"No Clean" capability of solder paste, flux and tubular solder with flux



core?

"No Clean" quality of printed board assemblies?

"No Clean" quality of printed board assemblies onto which devices have

been hand-soldered?

  and all of this for prototype and series production?



I have gleaned some insights from the TechNet archives, but any

additional input is very welcome.



Best regards



  Volkmar Huß



  Engineering Electronic Circuit Boards

  Aufbau- und Verbindungstechnik

  _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _



  DRÄGER ELECTRONICS



  Draeger Electronics GmbH

  Moislinger Allee 53-55

  D-23558 Lübeck



  Tel:   +49-451-882-3998

  Fax: +49-451-882-4365

  mailto:[log in to unmask]

  Website http://www.draeger.com/de/EL

  _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _



--

  Best regards / Mit freundlichen Grüßen



  Volkmar Huß



  Engineering Electronic Circuit Boards

  Aufbau- und Verbindungstechnik

  _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _



  DRÄGER ELECTRONICS



  Draeger Electronics GmbH

  Moislinger Allee 53-55

  D-23558 Lübeck



  Tel:   +49-451-882-3998

  Fax: +49-451-882-4365

  mailto:[log in to unmask]

  Website http://www.draeger.com/de/EL

  _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _