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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 19 Mar 2002 13:45:10 -0500 |
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My rule of thumb is ... shear a ball off (using tweezers and a rocking
motion), if solder remains on the component, it's good, if some solder
remains and some base metal is present, it's marginal, if no solder remains,
it's NG. Not very scientific, but it's a start.
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879
-----Original Message-----
From: [log in to unmask] [SMTP:[log in to unmask]]
Sent: Tuesday, March 19, 2002 12:29 PM
To: [log in to unmask]
Subject: [TN] BGA Solder Ball Shear
Are there any standards or rules to apply to shear strength of BGA
solderballs. What is considered good or bad, etc.?
Thank You,
Dennis Fall
Process Engineering Supervisor
Thin Film Technology Corporation
North Mankato, MN 56003-1702
Email: [log in to unmask]
Phone: 507-625-8445
Fax: 507-386-9269
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