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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 26 Mar 2002 15:36:39 +0100 |
Content-Type: | text/plain |
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Hi TechNetters,
we are working on defining our "No Clean" soldering process. The
solder-paste and flux manufacturers certify the "No Clean" capability of
their products to some extend, but what is the definition of "No Clean"?
And I don't mean the statement, that only inert residues of flux and
solder-paste additives remain on the board.
Are there any standards that can used as a reference?
How do you measure the:
"No Clean" capability of solder paste, flux and tubular solder with flux
core?
"No Clean" quality of printed board assemblies?
"No Clean" quality of printed board assemblies onto which devices have
been hand-soldered?
and all of this for prototype and series production?
I have gleaned some insights from the TechNet archives, but any
additional input is very welcome.
Best regards
Volkmar Huß
Engineering Electronic Circuit Boards
Aufbau- und Verbindungstechnik
_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
DRÄGER ELECTRONICS
Draeger Electronics GmbH
Moislinger Allee 53-55
D-23558 Lübeck
Tel: +49-451-882-3998
Fax: +49-451-882-4365
mailto:[log in to unmask]
Website http://www.draeger.com/de/EL
_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
--
Best regards / Mit freundlichen Grüßen
Volkmar Huß
Engineering Electronic Circuit Boards
Aufbau- und Verbindungstechnik
_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
DRÄGER ELECTRONICS
Draeger Electronics GmbH
Moislinger Allee 53-55
D-23558 Lübeck
Tel: +49-451-882-3998
Fax: +49-451-882-4365
mailto:[log in to unmask]
Website http://www.draeger.com/de/EL
_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
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