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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 8 Mar 2002 14:23:17 -0600 |
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Hi folks! Just a quick thanks to everyone who sent me a response on my
preform question - exactly what I needed! Ya just gotta love this forum -
quick, concise, no commercials, and absolutely straightforward assistance.
Now that I am armed with my preform information, I shall go out and attempt
to remove the alligators in the swamp. Thanks again.
Dave
Steve Owen <[log in to unmask]>@ipc.org> on 03/08/2002 02:50:47 AM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
to Steve Owen <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
To: [log in to unmask]
cc:
Subject: Re: [TN] BGA Soldersphere Attach - low tech method Inquiry
Dave,
If you go to www.intertronics.co.uk you should be able to find the
"preforms" you need we have just received samples.
Steve.
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: 07 March 2002 23:20
To: [log in to unmask]
Subject: [TN] BGA Soldersphere Attach - low tech method Inquiry
Hi TechNet Land! I have had one too many Diet Cokes today and thus my
brains have quit functioning (both braincells at once) - therefore I pose
the following question to ya'all:
I distinctly remember a company called "Raychem" which used to sell a
solderball area "preform" which you could use to re-bump a BGA component
after you removed it off an assembly. The "preform" used a water soluble
material which could be removed in a water cleaning system after reflowing
the solderspheres onto the BGA. I went looking on the web and can't find a
"Raychem preform" group (I found lots of Raychem but not the one I
remember). Have I had too much Diet Coke? Does anyone remember these guys?
Or have they closed up shop?
As always, thank in advance!
Dave Hillman
Rockwell Collins
[log in to unmask]
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