TECHNET Archives

February 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Olivia Mc Dermott <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 7 Feb 2002 10:18:56 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines)
Good Morning All,
We are a sub-contract manufacturer and are currently recruiting for a
quality engineer. We build PCBs in samll to medium volume. We also complete
final assembly incorporating plastics, chassis's, wire and harness
assemblies. Could any-one suggest, or is there a standard questionairre for
interview purposes? If not, and you were recruiting, what type of questions
would you ask and what type of answer would you expect?

Hopefully I'll get some excellent questions to ask during the interview.
Thanks in advance

Olivia Mc Dermott


_________________________________________________________________
Send and receive Hotmail on your mobile device: http://mobile.msn.com

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2