With water-soluble lead-free (Sn/Ag and Sn/Ag/Cu) paste, we saw a lot of solderballs until we went to nitrogen. It was like night and day.
>>> [log in to unmask] 2/6/02 11:41:33 AM >>>
IMHO: not much help with agressive OA fluxes.
opens process windows a bit with no-cleans.
may be important for Lead-Free processing.
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Grant Emandien
> Sent: Wednesday, February 06, 2002 10:38 AM
> To: [log in to unmask]
> Subject: [TN] Nitrogen atmosphere reflow soldering: Costs & Benefits
>
>
> 'netters,
>
> I am presently exploring the cost-benefits of nitrogen atmosphere
> soldering
> in our facility. Opinions and recommendations in literature
> obtained thusfar
> has been broad and varied. Some bemoan costs while others hail defects
> reduction. We presently have a nitrogen atmosphere wave soldering facility
> and yes, dross reduction leading to better looking joints.
>
> But what have your experiences been and the benefits gained by using
> nitrogen for (a) no-clean and (b) water-soluble solder?
>
> What are the limitations and any disadvantages of using nitrogen?
>
> TIA
> Grant
>
>
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