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February 2002

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Date:
Wed, 6 Feb 2002 08:32:10 +0800
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Hi, David,

Press fit/wire wrap connectors in military avionics motherboards have been
around since Adam was a boy, and are even in "state of the art" equipment
like the Eurofighter (sorry, 'Typhoon') radar, which underwent very
stringent qualification testing indeed without any failure in that
department. The budget for that project didn't allow much in the way of
legal expenses for motherboard failure claims.

Peter




                    David Douthit
                    <[log in to unmask]        To:     [log in to unmask]
                    ORG>                 cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    Sent by:             Aero/ST Group)
                    TechNet              Subject:     Re: [TN] Connectors and hole
                    <[log in to unmask]        diameters
                    ORG>


                    02/06/02
                    01:46 AM
                    Please
                    respond to
                    "TechNet
                    E-Mail
                    Forum.";
                    Please
                    respond to
                    David Douthit






Phil,


Isn't is common to have press fit bus connectors of backplane boards like
the multi layer VME bus boards?
YES!


How can this be different?
It's not!


Won't there be the same thermal cycling issues?
Yes! Plus vibration and laminant damage around the immeadiate area!


Just don't use this for high reliability electronics unless you have a very
good lawyer!


David A. Douthit
Manager
LoCan LLC



Phil Nutting wrote:
     This discussion brings up a question for me.  Our discussion has been
     centered on the fact that the holes are too small in diameter for the
     pin being inserted in the hole.  The discussion has suggested that due
     to thermal cycling there may be long term reliability problems with
     the hole plating and possible connections to internal layers.


     Isn't is common to have press fit bus connectors of backplane boards
     like the multi layer VME bus boards?


     How can this be different?


     Won't there be the same thermal cycling issues?


     Just a thought.
     Phil Nutting


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