Hmmm!

These press-fit connectors tend to be wire-wrapped and not pressed through
copper plating that interconnects to various layers in the board.
Backplanes also tend to be much thicker and thus more robust, though I'm
stretching a bit here for a counter argument. I guess the point probably is
that the press-through connector holes are designed for that purpose, while
Lorraine's connector holes are not.

Peter




                    Phil Nutting
                    <PNutting@KAISERSY        To:     [log in to unmask]
                    STEMS.COM>                cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    Sent by: TechNet          Aero/ST Group)
                    <[log in to unmask]>         Subject:     Re: [TN] Connectors and hole
                                              diameters

                    02/05/02 10:15 PM
                    Please respond to
                    "TechNet E-Mail
                    Forum."; Please
                    respond to Phil
                    Nutting






This discussion brings up a question for me.  Our discussion has been
centered on the fact that the holes are too small in diameter for the pin
being inserted in the hole.  The discussion has suggested that due to
thermal cycling there may be long term reliability problems with the hole
plating and possible connections to internal layers.

Isn't is common to have press fit bus connectors of backplane boards like
the multi layer VME bus boards?

How can this be different?

Won't there be the same thermal cycling issues?

Just a thought.
Phil Nutting

---------------------------------------------------------------------------------

Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]:
SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
---------------------------------------------------------------------------------





[This e-mail is confidential and may also be privileged. If you are not the
intended recipient, please delete it and notify us immediately; you should
not copy or use it for any purpose, nor disclose its contents to any other
person. Thank you.]

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------