IMHO the difference is the fact that the pins, in the holes that were too
small, were also soldered.

The initial pin insertion puts the holes under stress and the laminate
between the holes under stress.  Solder is applied and the laminate systems
are REALLY stressed.  Often there are laminate voids and areas of laminate
delamination the entire distance between the holes.

Even boards that are designed to have press fit pins in them react badly when
soldered - and we know that when there is a problem with a wire wrap pin one
of the "cures" is to hit the pin with a soldering iron.

Susan Mansilla
Robisan Lab

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