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February 2002

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Subject:
From:
David Fish <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 4 Feb 2002 20:50:26 -0800
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On controlling the amount of flux:
* A paint brush scheme or a little dab'ldoya are a bit too flakey
* BIG timers have these fancy flux depth controller machines that squirt
flux onto a plate. It has a wiper that goes around in circles [driven by a
motor under the plate and its shaft poking perpendicularly through the
plate ]. But then again, this is a production process thing, not a rework
thing.
* We use a credit card with a portion of the edge cut away to leave a tooth
on each end. We drag it through the paste to level it out, before dipping
the component.

Dave Fish
----- Original Message -----
From: "PHC L.L." <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, February 04, 2002 10:24 AM
Subject: Re: [TN] BGA Rework Using Paste vs. No Paste


> By the way... How much flux do you apply for this
> no-paste BGA rework?  How do you control the volume of
> the flux? Any particular tools?
>
> Thanks
>
>
>
>
> >It's a matter of useful information, not raw
> data(BS). I'll show you mine
> if you'll show me yours.
>
> Seems like most folks have shown their all and it
> appears in favor of less
> is more but as Daan said, more only is 10%. What's
> IPC's take on all this.
> What standard/rule/data/info is right. Most all of
> industry, as exemplified
> on this forum, points to paste flux, for rework
> instead of solder paste,
> whether applied crudely, rudely, or with MoonMan's
> flare for exactomundo by
> microstenciling the stuff.
>
> The MoonMan's and Werner's take to all this is flux
> it. It's still too
> simple to flux up but where are the standards?
>
> Thanks Dave for putting it all into perspective, or
> not.
>
> MoonMan
>
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