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February 2002

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Subject:
From:
Richard van Beveren <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 Feb 2002 10:06:29 +1100
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text/plain (79 lines)
Werner,

Thanks for the info - forgot to mention in my initial email that
through-hole solder joints are my primary concern, rather than surface mount
ones.  Early testing has shown the potential for cracking/tearing of solder
joints on wire links that I am bending after soldering (not unexpected!)  I
have extremely limited scope to get tooling into the area to support the
solder joints and ensure bending occurs well clear of it.  It's all a messy
business and basically a product on which design-for-manufacture has gone
out to lunch...all I can do at this late stage (no major changes to the
product possible) is try to ensure that whatever steps we take in assembly
result in a sufficiently reliable product - in this case it's an emergency
lighting control so that reliability has to be good.

Regards,

Richard van Beveren
Production Engineer

NEWTRONICS PTY LTD
(Receivers and Managers Appointed)
Private Bag No. 9
122 Melrose Drive
Tullamarine 3043
Australia
Phone: +61 3 9338 5088
Fax: +61 3 9338 5022
Email: [log in to unmask]
www.newtronics.com.au




> -----Original Message-----
> From: [log in to unmask] [SMTP:[log in to unmask]]
> Sent: Tuesday, 5 February 2002 07:31
> To:   [log in to unmask]
> Subject:      Re: [TN] Proving the reliability of a solder joint
>
> Hi Richard,
> Yes there is--IPC-9701. For more background also IPC-SM-785.
>
> Werner Engelmaier
> Engelmaier Associates, L.C.
> Electronic Packaging, Interconnection and Reliability Consulting
> 7 Jasmine Run
> Ormond Beach, FL  32174  USA
> Phone: 904-437-8747, Fax: 904-437-8737
> E-mail: [log in to unmask], Website: www.engelmaier.com
>
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