Electrovert once published a wave soldeing troubleshooting chart. I have a
ragged old copy. It lists many poential causes of the condition.
Process Related: solder temp too low, wave height too low, wave uneven,
solder contaminated (use J-STD-001 to evauate solder purity J-STD-006 is
intended for new alloy material), preheat temp too high or too low, flux
contaminated, flux specific gravity too low, flux no nolonger active, flux
not making contact, flux foam head low, flux uneven, flux blow-off
excessive, pallet too hot, conveyor speed high, conveyor vibration, conveyor
angle low, early removal of board, board not seated properly.
Assembly Related: board contamination, component contamination, component
leads too long, improper board handling.
Board Fab Related: Board Oxidized.
Design Related: Pallet design, large plane on solder side, large unfilled
holes.
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Mr. Leslie A. Pollak
> Sent: Wednesday, February 27, 2002 3:57 PM
> To: [log in to unmask]
> Subject: [TN] Solder Projections
>
>
> Hi,
>
> Could soemone tell me what causes solder projections or what we call
> icicles.
>
> Or point us to IPC documentation that would help us.
>
> Thanks
> Mr. Leslie A. Pollak
>
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