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February 2002

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Subject:
From:
"Zweigart, Siegmund" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 27 Feb 2002 22:45:18 +0100
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Hello

In the moment we are planing to do an evaluation about VIA in Pad for OCC
finished boards.
Did anybody try the same?
What are the critical Points for 0603 or 0402 passives?
Is the sucking of solderpaste from the top to the bottom side during Reflow
an issue?
Any special requirements regarding profiles?

Thanks for your help

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