Guenter my great friend, if I may address you that way, I almost understand
all you say to the point of thinner might be better. Of course, I am totally
fact free as well.

Not in any way will an academic point of view make me any more informed. I
want the beef - the facts. If the IPC says something a bit wishy washy,
considering the status of 279's chair (sir Werner) and its fine staff, how
can I even pretend to understand the situation and even feel a bit warm and
fuzzy about solder joint reliability.

I know most of my non academic solder joints are fairly reliable but I still
question how so or much or or or or (cave talk down here)? The photos I
asked Steve to post, defy logic but point to a very messed up process not
even based on IMC formation. However, I did send some others to Werner and
Dave, and based on some findings by Collins and TI that found the IMC layer
to be too thick therefore effecting castration of the balls from the part.

Yes, much to ponder and, seemingly, much more for us all to learn about
solder, solderability, soldering, solder joint formation, and solder joint
reliability.

Are we getting close yet?

MoonMan

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