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February 2002

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Subject:
From:
"Bissonnette, Jean-Francois" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 4 Feb 2002 16:02:27 -0500
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Richard,

Please contact me on my corporate e-mail to let me know about your opinion
these standards

-----Original Message-----
From: Lee Whiteman [mailto:[log in to unmask]]
Sent: Monday, February 04, 2002 9:01 AM
To: [log in to unmask]
Subject: Re: [TN] Proving the reliability of a solder joint


Richard van Beveren,

You may want to consider the following test methods to determine solder
joint reliability:

Vibration: JESD22-B103-A Vibration, Variable Frequency
                MIL-STD 883; Test Methods 2005.2, 2006.1, 2007.2

Thermal Cycling: JESD22-A104-A Temperature Cycling
                          MIL-STD 883; Test Method 1010.7

The big thing is to determine the environment that the assembly will
experience during its lifetime, and develop an appropriate test. For
example, in certain aerospace applications, thermal cycling is performed
from -55C to 125C. These limits might be too severe for a commercial
applications.

Hope this helps. Good Luck.

Lee Whiteman
Senior Manufacturing Engineer
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x208
Fax: (610) 362-1290



> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Richard van Beveren
> Sent: Sunday, February 03, 2002 9:52 PM
> To: [log in to unmask]
> Subject: [TN] Proving the reliability of a solder joint
>
>
> Can anyone help with official standards that can be used to establish the
> reliability of a given solder joint / assembly method? (other than visual
> assessment)
>
> I am considering an assembly method that involves bending of auto-inserted
> wire links after soldering.  I am aware that this is not a
> preferred method
> but would like to know of any recognised tests that I can perform to test
> the reliability of the solder joint "in service."  Experience (and "home
> made" vibration testing of the final product) to date has shown
> little or no
> reduction in solder joint reliability but I am keen to be able to
> say, "yes,
> I have tested this assembly/joint in accordance with IEC/DIN/MIL XXX"
>
> Thanks in advance,
>
> Richard van Beveren
> Production Engineer
> NEWTRONICS PTY LTD
>
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