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February 2002

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Subject:
From:
Jeff Ferry <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 4 Feb 2002 14:31:19 -0600
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Fellow TechNetters,

Thanks for all the feed back to my sticky BGA rework question. Got 8-10
answers with most suggesting using flux vs. solder paste during replacement.

Not that I don't have the highest regard for all the TechNet gurus who
responded, but in hopes of getting a larger sampling I posted a survey at
http://www.circuitnet.com/survey_archive.htm. It's the second question from
the top.

The survey question reads:
What do you use when replacing eutectic ball BGA components?
Possible answers include:
1. Flux, no solder paste.
2. Flux is preferred, will use solder paste when necessary.
3. Solder paste.
4. Solder paste is preferred, will use flux without solder paste when
necessary.

Sure would appreciate your visiting the page and posting your particular
preference. The results are immediatly available for all to see.

Jeff Ferry
CEO
Circuit Technology Center, Inc.
www.circuittechctr.com

PS: If you have a survey question relating to circuit boards, or
electronics manufacturing, I'd be happy to build a survey and post for all
to respond to.

PPS: How's bout those New England Patriots

On Thu, 31 Jan 2002 10:54:24 -0600, Jeff Ferry <[log in to unmask]>
wrote:

>Fellow TechNetters,
>
>We nearly always apply solder paste to the circuit board when we replace
>BGA components during rework. Yet, after speaking with a handfull of BGA
>equipment companies at APEX, seems like they all recommend using flux only
>vs. paste, unless the circuit board is used in a high rel application.
>
>What do ya'all do/recommend for BAG rework? Can you point me to any
>studies/reports on the subject?
>
>Thanks,
>
>Jeff Ferry
>CEO
>Circuit Technology Center, Inc.
>
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