Dear All,

For a stencil of 5 mils, how does one arrive at the upper and lower
specification limits (USL and LSL) of the solder paste to be deposited? I
have read papers on stencil printing that have used the USL and LSL for
arriving at a stable process. Are there any industry standards to arrive at
the USL or LSL or these values have been arrived at based on experience?

Thanks and have a nice day.
Praveen

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