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February 2002

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Subject:
From:
Mark Stalcup <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 25 Feb 2002 11:55:44 -0600
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I am looking for some help concerning solder spatter.  I manufacture
ceramic hybrids that have gold plated terminal blocks (50 mil square)
placed near the edge of the hybrid.  We contiually see solder spatter
randomly located on the top of the blocks at at yield hit of anywhere from
2 to 30 percent.  We have set our oven profile such that there is the
minimum amount of preheat ramp, and we reflow in air.  Could anyone provide
some help on how to deal with this?  Any good resources for information,
abstracts, etc. that would help out?

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