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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 4 Feb 2002 17:33:17 +0000 |
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From experience 2 cooling zones would be preferable especially if the PCB
is densely populated and with heavy plane layers. These types of PCB's
would require allot of cooling before exiting the oven also I have seen
allot of problems with flux residue in the cooling sections if they are not
cleaned out regularly. There are oven manufactures eg. BTU who provide a
self cleaning system for the cooling sections.
Rgds
George
"Crain, Bob"
<Bob.Crain@GOO To: [log in to unmask]
DRICH.COM> cc:
Sent by: Subject: [TN] APEX reflow oven claims
TechNet
<[log in to unmask]
RG>
02/04/2002
15:51
Please respond
to "TechNet
E-Mail
Forum.";
Please respond
to "Crain,
Bob"
We are getting ready to purchase an SMT line for the first time. The boards
are for aerospace applications and will be10"x10", 14 layer with 2-4 heavy
plane layers in polyamide. Some salesmen said we will need 2 cooling zones
to properly solder these boards. I've got a handle on all the other
parameters, but can't separate fact from fiction on this one. Ideas?
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