Hi Eric,
You are right. Parallel and sequential testing will likely produce different
results...BUT there are big problems. They are primarily related to how the
results can be extrapolated to product reliability.
For instance, you will get dramatically different results if you first
T-cycle solder joints and than vibration load them or the other way around.
So, you really need to think carefully about what it is you REALLY are trying
to accomplish.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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