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February 2002

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 21 Feb 2002 12:27:26 -0600
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The sample order form included with the following document (developed by a committee that included most major stencil suppliers) would help you a lot.

IPC-7525 Stencil Design Guidelines

This document provides guidelines for the design and fabrication of stencils for solder paste and surface-mount adhesive. This is the first industry consensus document for stencil design. Stencil design for surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed, including overprint, two-print and step stencil designs. A sample order form and a user inspection checklist are also included for stencil design. 14 pages. Released May 2000. 

Jeffrey will receive an attachment with the 7525 Table of Contents and scope/purpose/background info for the guide.  Others receiving this reply from TechNet won't get the attachment but can get it from this link:  http://www.ipc.org/TOC/IPC-7525.pdf

Jack

>>> [log in to unmask] 02/21/02 07:29AM >>>
Technetters--
I need some information I hope you can supply:

1) What do I need to supply a stencil manufacturer to get a stencil made?
    Will a 1:1 artwork of the pads and an array drawing suffice?
2) How do I document that information? Stencil Drawing? Work sheet? Other?
3) How should I control it so that I meet ISO?
4) Any recommendations on stencil manufacturers?

As always TIA,

Jeffrey A. McGlaughlin CID
Sr. Designer
Battelle Memorial Institute
Columbus Ohio
[log in to unmask] 

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