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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 21 Feb 2002 08:28:26 -0600 |
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Good Morning Dan! From an assembly point of view your temperatures are
pretty workable for a reflow profile but the ramp rates are somewhat
restrictive. I have seen multiple instances of reflow processes running at
ramp up/down rates of 4-6 C/sec with no danger of impacting the component
integrity. Is there a material rationale for the 2 C/sec ramp rate
suggestion? As an assembler I am always give preference to components with
the maximum reflow profile robustness.
Dave Hillman
Rockwell Collins
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"Dan R. Johnson" <[log in to unmask]>@ipc.org> on 02/20/2002 03:14:49 PM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
to "Dan R. Johnson" <[log in to unmask]>
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Subject: [TN] Safe processing window
A couple of questions for what has become my best engineering resource.
Management has asked me to provide a re-flow profile for our product, a
surface mount component built on FR-4 with lead free solder. I am
reluctant, I would prefer to generate a "safe processing window" type
document. As manufacturing professionals what do you prefer?
The window would spec ; max 2 C /sec ramp up, max 60 sec dwell above 180
C, max 220 C peak, and a 2 C/sec max ramp down. Could you live with this?
Many thanks for your help,
Dan
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