Thanks Dan and others for the input and it seems mostly positive. Still, I
question the part first because it is based on the LCCC style. I haven't
tried dissecting a part yet to determine what sits atop the PCB and how the
internal device/chip is attached to it - die attache and wire bond I suppose.

My biggest concerns are the gold and bow and twist of the part and the PCB
to which it is attached. We have another out of control board situation, I
just got into yesterday, and its warpage problem I am now solving
(completely unbalanced MLB construction - what else but an unqualified
supplier). The gold bothers me because I do not know its thickness and
whether it is electroplated.

With regards to gold, if electroplated, are you or anyone else solder
dipping to remove it before attempting assembly. Just don't want
embrittlement some where down the line.

Thanks again,

MoonMan

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