Hi Richard,

It depends on the actual component dimensions and pinouts.  Sometimes it
works out, sometimes it doesn't.  Unfortunately, not all component
manufacturers mean the same thing when they say "SO" and "SOP".  If you'd
like to send me drawings and pinouts of the two packages (or at least a full
manufacturer's part number for each), I'd be happy to look them over.

Something to consider is that if the pads from one component are under the
body of the other and there is not much standoff height, I could imagine
some trouble.  If this is indeed a problem, you would need a separate
stencil for each variant of the assembly.

Regards,

Seth Goodman
Goodman Associates, LLC
tel 608.833.9933
fax 608.833.9966


> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Richard Hawkins
> Sent: Wednesday, February 20, 2002 10:57 AM
> To: [log in to unmask]
> Subject: [TN] pads for so package and sop package?
>
>
> I have a situation in which my company wishes to "dual source" an IC, the
> only catch is that one is an so package and the other is a sop package.
>
> This is a new problem for me.  I am looking to the experience and
> expertise
> of this list to help me come to the correct answer for my company.
>
> Any advise/opinion/experience will be appreciated.
>
> TIA
>
> Sincerely,
>
>
> Richard Hawkins
>
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