Hi Richard,

You may have already noticed, but the new IPC-9701 that Jack Crawford announced last Friday sounds like it's just what you're looking for. 

Best regards,

Daan Terstegge
SMT Centre
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net


> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Richard van Beveren
> Sent: Sunday, February 03, 2002 9:52 PM
> To: [log in to unmask] 
> Subject: [TN] Proving the reliability of a solder joint
>
>
> Can anyone help with official standards that can be used to establish the
> reliability of a given solder joint / assembly method? (other than visual
> assessment)
>
> I am considering an assembly method that involves bending of auto-inserted
> wire links after soldering.  I am aware that this is not a
> preferred method
> but would like to know of any recognised tests that I can perform to test
> the reliability of the solder joint "in service."  Experience (and "home
> made" vibration testing of the final product) to date has shown
> little or no
> reduction in solder joint reliability but I am keen to be able to
> say, "yes,
> I have tested this assembly/joint in accordance with IEC/DIN/MIL XXX"
>
> Thanks in advance,
>
> Richard van Beveren
> Production Engineer
> NEWTRONICS PTY LTD
>
> ------------------------------------------------------------------
> ---------------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search previous postings at: www.ipc.org > On-Line Resources &
> Databases > E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> ------------------------------------------------------------------
> ---------------
>

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------