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February 2002

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Subject:	Antw: [TN] Solder
From:	Guenter Grossmann <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 20 Feb 2002 08:59:34 +0100
Content-Type:	text/plain
Parts/Attachments:	text/plain (33 lines)

Antonio

None when it comes to reliability or production. When AgPd plated terminations are used the 2 percent silver slow down the dissolution of the metallisation during the soldering process.


Best regards


Guenter

EMPA
Swiss Federal Institute for Materials Testing and Research
Centre for Reliability
Dipl. Eng. Guenter Grossmann

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1823 4054
mail:     [log in to unmask]

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