Hi Robert,
This depends on component geometry (0805, 0603, 0402, etc), pad geometry and
trace geometry, but IMHO, your skepticism is justified. Assuming the pad
geometry is appropriate for the component, the distance between the
component end termination and the PCB pad is so small compared to the
component end termination width and pad overlap that the inductance of this
joint is already negligible compared to the component itself and the trace
leaving the pad. As long the joints are wetted, there is no solder bridging
and the component is not cracked, it sounds like the problem is elsewhere.
Regards,
Seth Goodman
Goodman Associates, LLC
tel 608.833.9933
fax 608.833.9966
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Furrow, Robert Gordon
> (Bob)
> Sent: Tuesday, February 12, 2002 1:55 PM
> To: [log in to unmask]
> Subject: [TN] High Frequency Effects
>
>
> Hi TechNet,
>
------------- snip ---------------------
> acceptance. My question to the TechNet is whether it is possible
> to improve
> performance for high speed signals if you add solder volume to a secure
> connection? As always the input from this group is appreciated.
>
> Thanks,
> Robert Furrow
> Printed Wiring Board Engineer
> Supply Chain Networks
> Lucent Technologies
> 978-960-3224 [log in to unmask]
>
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