Steve,

My thanks as always. Just some notes about the pics:

1) The gull wing lead clearly shows indications of over heating during
reflow as the solder wicked way up the lead. Lot's of focused IR crap in
those days.

2) The J lead solder joint (solder really never wetted to the lead but did
to the board) cracked because of excessively oxidized leads. About all this
customer's product was wiped out because the component supplier, a big one
at that, screwed up.

3) The two chip device voidings were found after soldering them to a ceramic
substrate and then simply pulled off it. We were talking about these
substrates before and I forgot to mention Coors and Kyocera both provide two
inch, or so, square samples. I always carry about half a dozen of them
around until the break - then I get new ones.

Enjoy,

Earl

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