Can anyone help with official standards that can be used to establish the
reliability of a given solder joint / assembly method? (other than visual
assessment)

I am considering an assembly method that involves bending of auto-inserted
wire links after soldering.  I am aware that this is not a preferred method
but would like to know of any recognised tests that I can perform to test
the reliability of the solder joint "in service."  Experience (and "home
made" vibration testing of the final product) to date has shown little or no
reduction in solder joint reliability but I am keen to be able to say, "yes,
I have tested this assembly/joint in accordance with IEC/DIN/MIL XXX"

Thanks in advance,

Richard van Beveren
Production Engineer
NEWTRONICS PTY LTD

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