Some of you may be interested in the following:

1) Starting at the top, the top cover on the TI 6203 DSP/CSP's is aluminum
going to copper plated with something then evolving soon into a glob top

2) The top currently used is only attached to the die - not to the BGA
substrate. Interesting MSD issues as class 4 sensitive devices and all that
entails. Also, the lid could not impose stresses on the BGA substrate
causing excessive warp issues.

3) The flip chip is attached, via "normal" industry bonding and underfill
techniques.

4) The BGA substrate is BT and is 6 layers going to two. Don't know how
they're going to accomplish this feat.

5) Our "X" version parts had BGA balls falling off the substrate first
because of a "bad supplier/process" or some such thing. Others fell off
because of our "bad supplier/process" wherein an adequate thermal profile
could not be achieved. The oven was a Heller 1700 though I belive it
capable, the supplier could not get the recipe and cold solder joints were
effected also causing balls to detach from both substrates.

6) I'll keep you posted as we build new boards and run the reliability
testing.

MoonMan

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