Hey Jim. Take a look at the February 2002 issue of Assembly magazine. It has
a two page article on this very subject. If you don't subscribe you may be
able to find it at www.assemblymag.com . If not, contact me off-forum and I
can fax you a copy.

Bob

=======================
Robert Barr
Manufacturing Engineering
Formation, Inc.
Voice: 856-234-5020 x3035
Fax: 856-234-6679

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Jim Kittel
> Sent: Thursday, February 14, 2002 9:24 AM
> To: [log in to unmask]
> Subject: [TN] Vapor Phase Soldering ReVisited!
>
>
> Dear TechNetters,
> While attending the last APEX show, I was surprised to find vapor phase
> soldering equipment essentially non-existent.  At least the high end,
> conveyorized machines were not to be found.  The equipment being
> peddled for
> no-lead SMT soldering is pretty much 'improved' convection reflow stuff.
> With our convection reflow oven we have to run about 40 C. above
> melt point
> to reliably solder our more difficult high layer count boards with large
> BGA's (about 30% of our business).  If we built these with 'no-lead'
> processing (which may be required soon) I  expect the boards would be
> approaching 250 C.,  which our organic boards and parts would not
> tolerate.
> It seems to me, in-line vapor phase soldering with a smooth
> transition into
> the vapor chamber, would offer many advantages.  If we could find
> a thermal
> liquid with a boiling point of 225 or 230 C., we may be able to solder
> 'no-lead' pastes with only a 10 or 15 C. delta and not worry about melting
> down parts.  Also we would be in an easily controlled inert atmosphere to
> reduce oxidation.
> Am I missing something in this analysis that is obvious to everyone else?
> Help?  Where have all the vapor phase machines gone?
> Jim Kittel
> L-3 Communications
>

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