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February 2002

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Subject:
From:
John Moses <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 Feb 2002 09:30:53 -0500
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Hi,

I have found that with most components it is not necessary to use two different melt temp solders for double sided reflow.  The surface tension keeps the bottom components in place unless you have some unusually heavy components.  Connectors can sometimes be a problem.

John

>>> [log in to unmask] 02/13/02 10:08AM >>>
Hello,

As a part of our preparations to set up an internal SMD line, I would like
to get your opinion on the following topic.
What are the problems, if any, associated with reflowing the double sided
SMT board using solder paste with different melting points for top and
bottom.
Is this a fairly common process?
If not what would you recommend as a best assembly process for double sided
SMT boards?


Thanks in advance,

Jerry

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